Cornercase Solutions LLC Capability Statement

Core competencies

• Detector and focal plane test. Sensor chip assembly through focal plane module and array. Radiometric, spectral, and spatial characterization with image analysis.
• Integration and test leadership. Campaign planning and execution through build, assembly, and environmental qualification and acceptance.
• Environmental test. Thermal vacuum and EMI and EMC at detector, instrument, spacecraft, and observatory level, including procedure authoring.
• Ground support equipment and test planning. GSE design, test plans and procedures, LabVIEW automation, cost account management.
• Instrument systems engineering. Customer technical representation and supplier oversight across distributed international teams.

Detector technologies

HgCdTe SWIRSilicon CCDSilicon PIN ROIC waferTeledyne H4RGRaytheon Astro2k

Differentiators

• Detector-level depth and observatory-level breadth in a single point of contact, from ROIC wafer test to spacecraft environmental campaigns.
• Responsible engineering authority and cost account manager on flight deliveries, so scope, cost, and schedule are handled alongside the technical work.
• Customer-side technical representation across multi-national supplier chains.
• Direct experience on both sides of the table: detector manufacturer, prime contractor, and government-side support contractor.

Qualifications

United States citizenVacuum system operation Cryogen handlingRadiometry and image analysis Spanish

Flight program heritage

• Roman Space Telescope. Focal plane array build and test, then Wide Field Instrument, integrated payload, and observatory thermal vacuum and EMI and EMC.
• NEODaC. Si PIN high-speed digital output detector test and characterization, test planning, and ground support equipment.
• WFIRST detector characterization. SWIR HgCdTe sensor chip assembly test across the Teledyne H4RG and the Raytheon Astro2k.
• Robotic External Leak Locator. Integration and test campaign for three flight instruments.
• Ground Based Telescope Demonstration. Test engineering authority for visible and near infrared Si PIN staring focal plane modules.
• WorldView-3 SWIM. Test engineering authority for two flight SWIR focal plane modules, ROIC wafer through focal plane module.
• LISA Pathfinder. Instrument assembly, integration, and test oversight as the agency's customer representative.
• Landsat 8 OLI. Focal plane module and array test, with LabVIEW ground support equipment for spectral, radiometric, and spatial test.
• Hubble ACS Repair, SM4. Flight system level EMI and EMC for the CCD electronics box and low voltage power supply replacement.
• Hubble WFC3. Acceptance testing of flight candidate UVIS silicon CCDs and HgCdTe infrared detectors.
• Deep Impact. Spacecraft test through launch, then operations support through the Tempel 1 encounter.

Skills and disciplines

• Test and characterization. Sensor chip assembly, focal plane module, and array levels. Radiometric, spectral, and spatial performance, image analysis, validation of automated test calculations.
• Environmental test. Thermal vacuum, EMI and EMC, launch pad functional test, procedure authoring and execution.
• Program and team roles. Integration and test management, responsible engineering authority, cost account management, test readiness and pre-shipment review.
• Tools. LabVIEW, MATLAB, Python, FORTRAN, test automation and instrument control.